Key Research Areas

In the realm of system integration on boards level the IZM services range from consultation, to process development, right through to technical system solutions. Our research focusses on the development of processes and materials for interconnection technologies on board, module and package levels as well as the integration of electrical, optical and power-electronic components and systems.

Fraunhofer IZM’s substrate integration line combines state-of-the-art assembly equipment with a complete large-format PCB production and is one of a kind worldwide. Besides precision assembly, embedding technologies and highly reliable encapsulation processes we develop cutting-edge panel-level packaging technologies, which in turn provide a start-to-finish manufacturing opportunity for system-in-packages, modules and miniaturized systems on large formats.

We assist companies with application-oriented pre-competitive research, as well as the development of prototypes and small volume production. Our services include application advice, technology transfer and further qualification of personnel through practical training.

We focus in particular on the challenges of optical and power electronics, as well as the requirements of high-temperature and high-frequency applications and enabling technologies, e. g. for medical devices.