Event / May 09, 2023 - May 11, 2023
From May 9-11, 2023 the SMTconnect – Europe’s leading trade fair for System Integration in Micro Electronics – will be taking place in Nürnberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public. Main topics are design and development, PCB production, components, assembly, soldering, packaging and test systems.
We cordially invite you to visit us at the Fraunhofer IZM booth! Here you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.
Intelligent electronic systems – available everywhere and to everyone! In order to make this possible, components need to have exceptional properties. Depending on the application, they need to function reliably at high temperatures, be extremely miniaturized and moldable to individual build spaces or even flexible.
Fraunhofer IZM helps companies around the world develop and assemble robust and reliable electronics to the very cutting edge and then integrate them into the required application. To this end Fraunhofer IZM develops adapted system integration technologies on wafer-, chip- and board level. Our research continues to improve reliability and helps customers confidently predict a product’s lifetime.
At SMTconnect 2023 Fraunhofer IZM will be presenting the newest applications in industrial and power electronics, as well as research results from wafer level packaging, substrate integration, assembly and reliability.
Come and see us in Hall 5!
In the realm of system integration on boards level the IZM services range from consultation, to process development, right through to technical system solutions. Our research focusses on the development of processes and materials for interconnection technologies on board, module and package levels as well as the integration of electrical, optical and power-electronic components and systems.
The highest integration densities possible in heterogeneous assemblies are achieved using wafer-level integration. At Fraunhofer IZM all processing steps are carried out at wafer level after the actual front-end processes have been completed. The packages we develop have lateral widths almost identical to the chip dimensions. We also include active and passive components on the wafer in interlayers and even higher integration densities are achieved with 3D integration using through-silicon vias (TSV)
Apart from ensuring the best possible thermal system design, understanding thermomechanical behavior on package, component and module levels is critical for ensuring overall system reliability. Thermally and thermo-mechanically induced failure mechanisms can lead to premature failure and limit lifetime.