Virtual event  /  July 28, 2020  -  July 29, 2020

SMTconnect

SMTconnect goes digital

SMTconnect goes digital

This year, the SMTconnect – Europe’s leading trade fair for System Integration in Micro Electronics – will be taking place online only. 

We cordially invite you to visit Fraunhofer IZM online to experience the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories.   

Fraunhofer IZM – Intelligent Interconnection Solutions

Intelligent electronic systems – available everywhere and to everyone! In order to make this possible, components need to have exceptional properties. Depending on the application, they need to function reliably at high temperatures, be extremely miniaturized and moldable to individual build spaces or even flexible.

Fraunhofer IZM helps companies around the world develop and assemble robust and reliable electronics to the very cutting edge and then integrate them into the required application. To this end Fraunhofer IZM develops adapted system integration technologies on wafer-, chip- and board level. Our research continues to improve reliability and helps customers confidently predict a product’s lifetime.

At the virtual SMTconnect 2020 Fraunhofer IZM will be presenting the latest trends in electronic packaging and smart system integration from our laboratories. Have a look at the newest applications in industrial and power electronics, as well as research results from wafer level packaging, substrate integration, assembly and reliability.