The department of RF & Smart Sensor Systems focuses on research and development of application-specific wireless sensor nodes, radar and proximity sensor systems as well as wireless communication and high-performance computing (HPC) modules for a wide range of application fields.
Furthermore, we perform in-depth characterization of electronic packaging technologies, and develop innova-tive designs for RF/high-speed, millimeter-wave (mmWave) and terahertz (THz) packaging.
Our R&D activities concentrate on the following areas:
- High-frequency Packaging
- Components and Modules for Communication (e.g. 5G/6G) and Computing
- Radar and Proximity Sensor Systems
- Wireless Sensor Nodes and Systems
- Micro Energy Storage
- Physical Design Tools and Software
We collaborate closely with industry partners worldwide and provide cost-effective and innovative solutions at every level along the value chain, from materials to systems.
We look forward to welcoming you as our cooperation partner.