We research integration technologies for system-in-package products, focusing in particular on device assembly for highly integrated packages and encapsulation and coating processes based on polymeric materials. Our technology portfolio in- cludes pick-and-place processes – also for large-area substrates and stacked assemblies – and a wide variety of encapsulation processes, from dispensing, jetting to film coating, through
to transfer and compression molding. Material, process and device analyses complete our range of expertise.
- [Contactless] assembly processes for system-in-packages
- Encapsulation processes – large-volume & wafer-level
- Polymer and package analysis, including ultrasound and X-ray CT
- Nano-modified materials and surfaces