Working Group Assembly and Encapsulation

We research integration technologies for system-in-package products, focusing in particular on device assembly for highly integrated packages and encapsulation and coating processes based on polymeric materials. Our technology portfolio in- cludes pick-and-place processes – also for large-area substrates and stacked assemblies – and a wide variety of encapsulation processes, from dispensing, jetting to film coating, through
to transfer and compression molding. Material, process and device analyses complete our range of expertise.

  • [Contactless] assembly processes for system-in-packages
  • Encapsulation processes – large-volume & wafer-level
  • Polymer and package analysis, including ultrasound and X-ray CT
  • Nano-modified materials and surfaces

Process-oriented Material Analytics and Process simulation


  • Siplace CA3 Pick & Place System
  • Datacon evo 2200 Pick & Place System
  • Towa Y120 Molding System
  • Fico mms-i 90 Molding System
  • Asymtek Axiom Dual Head Dispensing & Jetting System
  • X-Ray microscope GE Phoenix nanomex 180 CT
  • CSAM system Sonoscan D9000