Optical Interconnection Technology for Customized Photonic Modules

High-Precision Assembly of Micro-Optical Components

The OIT – Optical Interconnection Technology working group handles the automated assembly and alignment of micro-optical benches and chassis like circuit boards or ceramic and glass substrates. One specific application requiring absolute precision in assembly and gluing / soldering is the integration of lens arrays on laser diode bars with multiple emitters.

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Overview Electrical-Optical Circuit Board EOCB

• Integrated Waveguides in Glass
• Metallization on Glass
• Laser structuring of Glass
• Optical Characterization

Electro-optical circuit boards or EOCB can realize the immense potential of optical signal transmissions for circuit board and chip design. In telecommunications, the waveguides included in the optical layer can receive the signals from fiber conductors and navigate them to their destinations on the circuit board.

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Optical fiber processing

Optical fibers with different geometries and spectral operation from UV to MIR can be processed to create radial-firing fibers, fused couplers, lensed fibers, bundles, fiber caps, 3D resonators, bended fibers, connections of fiber-to-chip & fiber-to-GRIN lens, etc. Customized CO2 laser processing systems, IR heaters, Vytran cleaver and Fujikura splicer are used as standard tools.

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Optical Sensors

Optical sensing has great potentials of high resolution, electromagnetic immunity, electrical isolation and wide dynamic range. Such features make optical sensors of great importance in applications such as telecommunications, aerospace, medicine, environmental and atmospheric monitoring.

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LED design – assembly – characterisation

From the beginning of solid state lighting IZM was involved in LED development. Assembly processes for LEDs with highest power and power density were developed as well for LEDs in harsh environment or just to make mass production more reliable but cost-effective, too.
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High-precision assembly of micro-optical components

The OIT – Optical Interconnection Technology working group handles the automated assembly and alignment of micro-optical benches and chassis like circuit boards or ceramic and glass substrates. more info

Production technology for optical systems (PrOpSys)

The automatic assembly of optical packages has accumulated needs compared to other industrial divisions. more info

Optoelectronics

Depending on the field of use optoelectronic components have very different requirements. Datacom lasers und photodiodes need to be single mode compatible and the accuracy of the assembly must be better than one micrometre to fulfil today’s requirements for data rates. 
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Polymer assembly and structuring technologies for optical and fluidic applications

In its work on polymer-based optical packaging and interconnection technologies, Fraunhofer IZM investigates technologies and processes for constructing photonic assemblies by gluing and polymer fiber bonding and the structuring of polymers by hot stamping. more info

Fiber lensing

Besides the conventional fiber technologies like splicing, polishing and coating, glass fibers are provided with customer-specific fiber lenses for particular packaging requirements. more info

Adhesive-free coupling of glass fibers and capillaries by laser welding

Laser welding for the manufacturing of firmly bonded, fiber optic or microfluidic glass/glass interconnections. more info

Introducing Agriphotonics: Smart laser systems and AI-driven image recognition for a digital agriculture 4.0The “Insect Laser” project was set up to test a combined laser and image recognition technology developed at Fraunhofer IZM for pest control in grain stores.

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Label free photonic sensing platforms are revolutionizing Point of Care diagnostic methods, allowing high sensitivity and high compactness needed for fast and reliable detection of infectious and autoimmune diseases. PoC BoSens is a transnational project that contributes to the development of a portable device based on an array of highly sensitive photonic micro-resonators.

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The objective of the QuantumCascade project is the design of a multispectrum MIR light source as an easily integrated system component for use in applications that work with mid-infrared light. The system should be usable without requiring particular knowledge of the complex technology behind multispectrum light sources. This makes it available for commercial enterprises from other fields, e.g. medical technology, facilitating the development of innovative systems without the risk of having to design a stable and controlled light source of this type.

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