Working Group Embedding & Substrate Technologies

The group Embedding & Substrate Technologies deals with the development of new processes for organic substrates and the embedding of components into substrates. The specific topics of work are:

  • Embedding Technology
  • Stretchable Electronics
  • PCB Finish and Reliability
  • Micro Galvanic
  • Substrate and components Biocompatibility

The group has a full process line for manufacturing of organic substrates up to 18"x24" format. It contains equipment for lamination, laser drilling, mechanical drilling, Laser Direct Imaging (LDI), galvanic, etching and electrical testing. Innovative technologies are developed and transferred into production scale. Beside cooperation with partners from industry and research, prototypes and small series are manufactured. Several process transfers to customers have been made already. All technologies developed within the group are available for licensing.

Equipment relating to embedding & substrates

  • Orbotech Paragon 9000 Laser Direkt Imaging (LDI)
  • Siemens Microbeam Laser Drill
  • Schmoll MX1 Mechanical Drill
  • Lauffer Vaccum Lamination Press
  • Datavon evo Die and Flipchip Bonder
  • Dek Horizon Printer
  • Schmid Kombiline Development, Etch & Strip
  • Spea Multimode 4040 Flying Probe Tester
  • Fischerscope (RFA Schichtdickenmessung)