Working Groups

Technologies for Bioelectronics

Tiny implants with a compact 3D layout, with all components that give the system its intelligence integrated on the device
© Fraunhofer IZM
Tiny implants with a compact 3D layout, with all components that give the system its intelligence integrated on the device

We design and fabricate active neural interfaces. We integrate small custom-designed electronics into microsystems for stimulation of and recording from the neural tissue. Our microsystems are often flexible implants based on biocompatible materials tailored for the central or peripheral nervous system. We design, fabricate, package and test our implants for long-term use. We also investigate new approaches for neural stimulation and wireless power transfer.

  • flexible electrode fabrication for neural stimulation and recording
  • protection of active implantable devices based on soft materials
  • ultrasound wireless power transfer for deep implants
     

Team and contact

Anna Pak

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Anna Pak

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

Konstantina Kolovou-Kouri

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Konstantina Kolovou-Kouri

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Andrés Felipe Salazar Jaramillo

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Andrés Felipe Salazar Jaramillo

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Andrada Iulia Velea

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Andrada Iulia Velea

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Lukas Holzapfel

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Lukas Holzapfel

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

Raphael Panskus

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Raphael Panskus

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

Alumni