Technologies for Bioelectronics

Technologies for Bioelectronics

Tiny implants with a compact 3D layout, with all components that give the system its intelligence integrated on the device
© Fraunhofer IZM
Tiny implants with a compact 3D layout, with all components that give the system its intelligence integrated on the device

We design and fabricate active neural interfaces. We integrate small custom-designed electronics into microsystems for stimulation of and recording from the neural tissue. Our microsystems are often flexible implants based on biocompatible materials tailored for the central or peripheral nervous system. We design, fabricate, package and test our implants for long-term use. We also investigate new approaches for neural stimulation and wireless power transfer.

  • flexible electrode fabrication for neural stimulation and recording
  • protection of active implantable devices based on soft materials
  • ultrasound wireless power transfer for deep implants
     

Packaging technologies for bioelectronics

Technologies for Bioelectronics
© Fraunhofer IZM

Investigating a variety of non-hermetic packaging solutions for implantable electronic devices with a view to maximizing the safe operational lifetime within the body.

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Integration & interconnection of components on biocompatible polymer substrates

Technologies for Bioelectronics
© Fraunhofer IZM

Developing platform technologies to integrate a variety of components into intelligent neural implants on soft substrates.

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Electric & ultrasound neuromodulator system design

tsr-2 PU-based acoustrode / PU-basierte Akustrode
© Fraunhofer IZM

Investigation of electric and acoustic neuromodulation modalities, aiming to increase the energy efficiency and spatial selectivity of the stimulation.

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US power transfer & communication for implantable devices

Technologies for Bioelectronics
© Fraunhofer IZM

Exploring the possibilities for wireless power transfer and communication through ultrasound.

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Characterisation and reliability testing of implantable devices

Technologies for Bioelectronics
© Fraunhofer IZM

Investigation of electrode performance and encapsulation reliability.

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Automated US field measurements

Technologies for Bioelectronics
© Fraunhofer IZM

Investigation of transducer performance and ultrasonic material characterization using automated sound field measurements.

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Preparation of setups for clinical trial settings

© Olivier Le Moal / stock.adobe.com

Design, testing and documentation of experimental devices prior to clinical trials.

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Deposition & structuring of biocompatible polymers

Technologies for Bioelectronics
© Fraunhofer IZM

Biocompatible polymer-based packaging solutions for implantable electronic devices with a range of form-factors.

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Deposition & structuring of thin-film metals and ALD-ceramics

Technologies for Bioelectronics
© Fraunhofer IZM

Solutions for the deposition and structuring of biocompatible interconnects and electrodes.

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Assembly of microelectronic components on flexible & rigid substrates

tsr-2 PU-based acoustrode / PU-basierte Akustrode
© Fraunhofer IZM

Biocompatible assembly and bonding of thinned chips

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NerveRepack

NerveRepack is a groundbreaking research project that aims to transform the lives of individuals with amputated or paralyzed limbs. The project's mission is to design and fabricate innovative implantable neuronal interfaces that can bidirectionally communicate with exoprostheses and exoskeletons.

mORE info

Moore4Medical

EU-funded project for the development of a toolbox technology platform for faster, more economical, and more impactful medical technology.

Fraunhofer IZM is responsible for coordinating the “Implantable Devices” workstream and developing solutions that use ultrasound for wirelessly charging micro-implants, transmitting data, and facilitating personalized therapies via neurostimulation.

mORE info

teaser Moore4Medicals
© Fraunhofer IZM

Team und Kontakt

Dr. Joshua Wilson
Dr. Joshua Wilson

Dr. Joshua Wilson

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

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Andrada Iulia Velea
Andrada Iulia Velea

Andrada Iulia Velea

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

Send email

Konstantina Kolovou-Kouri
Konstantina Kolovou-Kouri

Konstantina Kolovou-Kouri

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

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Lukas Holzapfel
Lukas Holzapfel - Fraunhofer IZM

Lukas Holzapfel

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-700

Send email

Raphael Panskus
Raphael Panskus

Raphael Panskus

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

Send email

Stefan Tornedde
Stefan Tornedde

Stefan Tornedde

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

Send email

Janett Hilgenfeld
Portrait Foto Janett Hilgenfeld

Janett Hilgenfeld

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

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Danny Ferreira Dias
Portrait Danny Ferreira Dias

Danny Ferreira Dias

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

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Luis Simon Meixner
Portrait- Luis Simon Meixner

Luis Simon Meixner

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

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Phannaro Nhem
Portrait Phannaro Nhem

Phannaro Nhem

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

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Pritesh Shirsat
Portrait - Pritesh Shirsat

Pritesh Shirsat

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone +49 30 46403-709

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Fraunhofer-Publica

Publications

Here you will find further literature on the topic of bioelectronic technologies

Alumni