Working Groups

We design and fabricate active neural interfaces. We integrate small custom-designed electronics into microsystems for stimulation of and recording from the neural tissue. Our microsystems are often flexible implants based on biocompatible materials tailored for the central or peripheral nervous system. We design, fabricate, package and test our implants for long-term use. We also investigate new approaches for neural stimulation and wireless power transfer.

• flexible electrode fabrication for neural stimulation and recording
• protection of active implantable devices based on soft materials
• ultrasound wireless power transfer for deep implants
   

• 200 mm wafer process compatibility
• Biocompatible metallisation via cost-effective semi additive manufacturing
• Near-hermetic conformal encapsulation using one-step Parylene C – ALD ceramic deposition
• Self-bonding thermoplastic polyurethane encapsulation for reduced delamination
• Laser Direct Imaging for rapid prototyping

• Pliable microelectrode arrays for peripheral nerve stimulation
• Flexible brain implant technology with high density interconnects
• Versatile electrical neural stimulation with multiple channels

Encapsulation Reliability Test Setup

• Automated in situ tests of encapsulated small implants
• Large-scale and long-term accelerated soak tests
• Lifetime estimation and failure mode investigations
  

Automated Ultrasound Field Measurements

• Frequency range from 100 kHz to 120 MHz
• Resolution down to 75 μm
• Lower dynamic range limit down to 40 Pa