Welcome - Fraunhofer IZM

High-End Performance Packaging from Wafer to System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

News

News | March 05, 20226

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

We are delighted to welcome Eric Fribourg-Blanc, Senior Program Officer at the Chips Joint Undertaking, to Fraunhofer IZM-ASSID on March 3, 2026. The program focused on an exchange of ideas on current projects and future topics of cooperation for establishing the APECS pilot line, as well as a tour of the clean room for cutting-edge 300-mm research.

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News | February 06, 2026

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

The European Union has granted EUR 25 million to the SUPREME consortium, marking a significant milestone in industrialisation of superconducting quantum technologies across Europe.

more info

News | January 20, 2026

Greater transparency for climate protection

Massive interest in a reliable way to assess the product carbon footprint for the IT industry

Net Zero by 2030: That is the ambitious goal of leading IT companies for their products’ carbon emissions, calculated across the entire semiconductor value chain.

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News | January 16, 2026

German-Indian semiconductor alliance

Shri S. Krishnan, Secretary in the Indian Ministry of Electronics and Information Technology, visited Fraunhofer IZM in Berlin. The focus was on close cooperation with the Research Fab Microelectronics Germany (FMD) and valuable exchanges with host Prof. Ulrike Ganesh, Director of Fraunhofer IZM, and Prof. Ronald Freund, Director of Fraunhofer HHI.

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News | January 15, 2026

CHASSIS

European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology

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News | December 02, 2025

Drones can detect smoldering embers in forests

As part of the EU-funded PROACTIF project, 42 European partners from research and industry are collaborating with Nokia to develop a new multi-sensor system designed specifically for drones. The German consortium, led by Fraunhofer IZM, is developing an innovative multi-sensor module that automatically detects heat.

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News | November 14, 2025

Next-generation edge AI for Europe

The PREVAIL consortium makes future technology accessible

Many innovative European companies working on edge AI technologies have, until now, been dependent on international supply chains. To reduce this dependence, research organizations from four EU countries – including Fraunhofer – are setting up a European pilot line for next-generation edge AI technologies.

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News

Events

Workshop | March 20, 2026

Darts Radar Workshop

As part of our CORNET research project, "DARTS: Design of Advanced Radar Technologies," the workshop "AI-Powered mmWave Radar: From Raw Signals to Insights" will take place on March 20, 2026. The DARTS project explores new methods for designing, integrating, and evaluating indoor radar systems, particularly for applications in logistics and medicine.

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Exhibition | April 21 – 24, 2026

Fraunhofer IZM will exhibit e-textiles at Techtextil 2026

Fraunhofer IZM is designing the fabric of the future: wearable, washable, and equipped with sensors. Wearable electronics will be on display at Techtextil, the leading international trade fair for technical textiles, at the Fraunhofer Textile Alliance's joint booth.

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Exhibition | March 24 – March 26, 2026

Fraunhofer IZM at XPONENTIAL Europe

The Fraunhofer IZM will be part of the IVAM joint booth at XPONENTIAL Europe, showcasing its latest expertise and innovations in the fields of RF & Radar Technologies.

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Events

Promoting chiplet technologies

Fraunhofer IZM is an integral part of the APECS pilot line with the development of high-precision integration technologies, the prototyping of substrates and research into modular chiplet architectures.

www.apecs.eu

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

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Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Berlin - Headquarters

Fraunhofer IZM Berlin

Gustav-Meyer-Allee 25
Gebäude 17/3
13355 Berlin

Telefon: +49 30 4 64 03-1 00
Fax: +49 30 4 64 03-1 11

Dresden - Branch of the institute

Fraunhofer IZM-ASSID

Ringstraße 12
01468 Dresden-Moritzburg

Telefon: +49 351 795572-12
Fax: +49 30 4 64 03-1 11

Cottbus - Branch Lab

Fraunhofer IZM Branch Lab Cottbus

Karl-Marx-Straße 69
03044 Cottbus
Phone: +49 355 383 770-12

Publications

Fraunhofer IZM annual report & Brochure

Crossing Frontiers in Microelectronics

Fraunhofer Institute for Reliability and Microintegration IZM

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

From Electric Cars to AI Servers: Packaging Concepts for Power Modules

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

Greater transparency for climate protection

German-Indian semiconductor alliance

CHASSIS

The Science Year 2026 is dedicated to the medicine of the future.

Drones can detect smoldering embers in forests

Next-generation edge AI for Europe

Get a taste of Fraunhofer IZM labs...

High-End Performance Packaging from Wafer to System

Departments

News

Eric Fribourg-Blanc visits Fraunhofer IZM-ASSID

EU selects SUPREME consortium to develop the union’s superconducting technology for wider industrialization

Greater transparency for climate protection

German-Indian semiconductor alliance

CHASSIS

Drones can detect smoldering embers in forests

Next-generation edge AI for Europe

News

Events

Darts Radar Workshop

Fraunhofer IZM will exhibit e-textiles at Techtextil 2026

Fraunhofer IZM at XPONENTIAL Europe

Events

Promoting chiplet technologies

Research Fab Microelectronics Germany

Berlin Center for Digital Transformation

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Fraunhofer IZM Berlin

Fraunhofer IZM-ASSID

Fraunhofer IZM Branch Lab Cottbus

Fraunhofer IZM annual report & Brochure

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