Welcome - Fraunhofer IZM

High-End Performance Packaging vom Wafer zum System

Our researchers miniaturize electronic systems, innovate packaging technologies, develop production processes, and pave the way for tomorrow’s microelectronics. We envision the future of electronic packaging with a sense for all the requirements and capabilities already expected of smart electronic systems and their components - be they heat-resistant, long-lasting, custom-shaped, or even stretchable. | more info

Departments

Fraunhofer IZM

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

Environmental & Reliability Engineering

RF & Smart Sensor Systems

Wafer Level System Integration

System Integration & Interconnection Technologies

News

Fraunhofer IZM | November 06 - 07, 2025

Electronic Packaging Days 2025

On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners.

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News | June 17, 2025

New standards for durable electronics: The EU energy label for mobile devices

A new energy label for mobile devices will be mandatory in the EU starting June 20, 2025. This applies to all smartphones and tablets with Android or iPadOS operating systems, ushering in a new era of European product policy.

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News | June 12, 2025

Dr. Lutz Stobbe honored with the Fraunhofer IZM 2025 Research Award

Measurable data and narrated stories for sustainable microelectronics - For his pioneering research in sustainable information and communication technologies (ICT) the Fraunhofer Institute for Reliability and Microintegration IZM honors Dr. Lutz Stobbe with the 2025 Research Award.

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News | June 03, 2025

Fewer post-surgical infections with innovative therapeutic technology

A novel way to manage infected wounds and a truly customized treatment without need for antibiotics: That is the idea behind a new medical technology project supported by the Federal Ministry of Education and Research, including the Fraunhofer Institute for Reliability and Microintegration IZM among the research partners.

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News | May 27, 2025

Towards next-generation edge-AI technologies: EU consortium opens services to external customers

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will open its services to external customers in June 2025.

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News | May 20, 2025

Fraunhofer IZM celebrates 20 years of partnership for high-tech innovation as a member of IVAM

The Fraunhofer Institute for Reliability and Microintegration IZM proudly marks its 20th anniversary as a member of IVAM – the "International Microtechnology Network".

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News

Events

Workshop | July 02 - 03, 2025

Component-to-System Level Packaging

The road to autonomous driving and the need for more electrified mobility have resulted in sizable changes for electronics such as semiconductors and batteries used in automotive applications. Smart homes and infrastructure, factory automation and preventive maintenance have driven significant advancements in industrial electronics too.

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Workshop | October 14 - 16, 2025

Fundamental radar signal processing in MATLAB based on TI Radars

Fraunhofer IZM offers a radar workshop based on a Texas Instruments (TI)-Ecosystem. The workshop focuses on signal processing of radar systems, especially for the IWR6843. It contains a theoretical and a practical part of 4 hours each.

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Change Hub Berlin | October 15 - 16, 2025

Green ICT Connect 2025

To promote an exchange between science, industry and politics on the topic of resource conservation in ICT, high-ranking representatives will meet for the third time at the conference for resource-conscious information and communication technologies »Green ICT Connect 2025«.

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Events

Berlin Center for Digital Transformation

The Berlin Center for Digital Tansformation is a cooperation of the four Berlin Fraunhofer-Institutes FOKUS, HHI, IPK and IZM.

The focus activities are technologies and solutions that take into account the increasing digitalization and networking of all spheres of life.

www.digitale-vernetzung.org

High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Functional Integration in Micro- and Nanoelectronics in Dresden und Chemnitz

https://www.leistungszentrum-mikronano.de/en.html

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.