The internal structure of an apparently homogeneous material can have a considerable influence on its properties. Structural analysis as part of a “physics of failure” approach can identify failure mechanisms so that avoidance measures can be taken.
Reliability Monitoring and Management aims at ensuring the reliability of electronic systems. With wide-ranging expertise about standards and excellent metrological equipment we can analyse vulnerability, determine reliability parameters and provide system level assessments.
Analytical, Numerical and Experiment-Based Assessment of Electromigration in Electrical Contacts
Analytical, numerical and experiment-based assessment of electromigration and highly interdependent parameters (thermal and surface migration) in electrical contacts for weak spot analysis, design optimization and lifetime prediction
A robust design for high vibration exposure requires an understanding of eigen-frequencies, natural modes and damping of electronic systems. Test objects range from minute structures (e.g. 400 µm bond wire) to components measuring up to 200 mm x 200 mm. The measurements and tests can be carried out at defined temperatures and humidity.
Mechanical and Thermal Characterisation of Materials
Determining mechanical and thermal parameters for materials for microsystem technology. Allowing for environmental conditions (e.g. humidity and temperature). Also determining parameters for the smallest samples and thin layers.
The demands on robustness and lifetime of electronic components, combined with decreasing development time, require methods that are able to derive the complexity of a system, evaluate it and indicate possible optimization potential in conceivable time.
Corrosion, Electrochemical Migration and Humidity Diffusion
Modern electronic systems are increasingly exposed to constantly changing environments in terms of humidity and variations of temperature cycling and thermal shocks. At the same time, the ongoing trend of miniaturization results in smaller designs, components and by that more tightly packaged systems.