Testing, Qualification, Reliability

Deformation Analyses

The in-plane und out-of-plane deformation of materials or composites due to external loads or internal stresses can be investigated by means of digital image correlation.

Structure Analyses

The internal structure of an apparently homogeneous material can have a considerable influence on its properties. Structural analysis as part of a “physics of failure” approach can identify failure mechanisms so that avoidance measures can be taken.

Reliability Assessment with FEM

Using FEM analysis, interconnection technologies and complex packages can be evaluated and optimised in terms of production quality, and reliability and lifetimeuse.

Reliability Assessment of Electronic Systems

Reliability Monitoring and Management aims at ensuring the reliability of electronic systems. With wide-ranging expertise about standards and excellent metrological equipment we can analyse vulnerability, determine reliability parameters and provide system level assessments.

Analytical, Numerical and Experiment-Based Assessment of Electromigration in Electrical Contacts

Analytical, numerical and experiment-based assessment of electromigration and highly interdependent parameters (thermal and surface migration) in electrical contacts for weak spot analysis, design optimization and lifetime prediction

Vibration Measurements and Tests

A robust design for high vibration exposure requires an understanding of eigen-frequencies, natural modes and damping of electronic systems. Test objects range from minute structures (e.g. 400 µm bond wire) to components measuring up to 200 mm x 200 mm. The measurements and tests can be carried out at defined temperatures and humidity.

Thermal Characterisation

Temperature measurements on assemblies with IR thermography and sensors e.g. to measure temperature distribution, hot spot temperatures, and thermal resistance and impedance.

Thermal Management

Minimising the thermal resistance of packages by the design and optimisation of cooling concepts, taking into account high power losses, heat flux,and ambient temperatures.

Mechanical and Thermal Characterisation of Materials

Determining mechanical and thermal parameters for materials for microsystem technology. Allowing for environmental conditions (e.g. humidity and temperature). Also determining parameters for the smallest samples and thin layers.

High performance computing cluster

The demands on robustness and lifetime of electronic components, combined with decreasing development time, require methods that are able to derive the complexity of a system, evaluate it and indicate possible optimization potential in conceivable time.