Embedding & Substrate Technologies

The group Embedding & Substrate Technologies deals with the development of new processes for organic substrates and the embedding of components into substrates. The specific topics of work are:

  • Embedding Technology for active and passive components
  • Stretchable Electronics
  • PCB Finish and Reliability
  • Micro Galvanic
  • Substrate and components Biocompatibility

The group has a full process line for manufacturing of organic substrates up to 18"x24" format. It contains equipment for lamination, laser drilling, mechanical drilling, Laser Direct Imaging (LDI), galvanic, etching and electrical testing. Innovative technologies are developed and transferred into production scale. Beside cooperation with partners from industry and research, prototypes and small series are manufactured. Several process transfers to customers have been made already. All technologies developed within the group are available for licensing.

Low-Inductance Packages for Fast-Switching Semiconductors

The basis for Miniature Converters with High Power Density

Niederinduktive Packages für schnell schaltende Halbleiter | Fraunhofer IZM
© Fraunhofer IZM

The evolution of very fast-switching semiconductors on silicon carbide (SiC) and gallium nitride (GaN) basis opens the gates for completely new standard power converters. The key is to not simply replace silicon semiconductors in a standard case – the minimal improvement in performance would be too dearly bought.

mORE info

System design | Simulation | Embedding technologies for SiC and GaN semiconductors

Inside view (model)of a 90A embedded power module (HHK project)
© Fraunhofer IZM | Volker Mai

The researchers at Fraunhofer IZM have many years of experience in both processing with embedding circuit board technology and the design and customized development of power electronics modules with power semiconductors based on silicon carbide (SiC), gallium nitride (GaN) and silicon (Si).

mORE info


Increase of efficiency and range

Expnat - Messe - SiCeffizient
© Fraunhofer IZM

The use of SiC semiconductors in drive inverters is becoming increasingly popular. SiC offers the possibility of increasing the power density and efficiency in the system through lower switching and conduction losses compared to silicon FETs.  

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Substrate Finish and Reliability

The interconnect behavior of any surface finish depends on layer built up, surface cleanliness, process bath chemistry, chemical and thermal stability, surface profile, pad design.

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Stretchable Electronics

Dehnbare Elektronik
© Fraunhofer IZM

During the past two decades a number of product concepts electronic build-ups have been developed, which inherently demand a certain degree of stretch (elongation, extension) to be accommodated within the electronic systems.

Fraunhofer IZM developed a technology to fabricate “stretchable printed circuits”. The dielectric carrier material of these circuitries is thermoplastic polyurethane as opposed to the glas-fibre-epoxy compound of rigid or Polyimid (PI), Polyethylenterephtalat (PET) or Polyethylenenephtalat (PEN) for flexible circuits.

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Inside view (model)of a 90A embedded power module (HHK project)
© Fraunhofer IZM | Volker Mai

Embedding is the process of integrating components, often chips, in PCBs. Both active and passive components can be embedded in laminates. The process has many advantages over conventional packaging techniques.

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Silicon carbide semiconductors, packaged for high-temperature applications, have the potential to increase switching frequencies and output substantially in future power electronics, while making them less susceptible to failure.

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Fraunhofer IZM eliminates the speed limit for power electronic switching
© Fraunhofer IZM | Volker Mai

Substrate Integration Line

  • CoB laboratory (die, ribbon, wire bonding down to 35 µm pitch)
  • Precision mounting laboratory (clean room, including chip-to-wafer bonder to 300 mm, thermocompression, thermosonic)
  • Embedding laboratory (high-precision pick and place machine, circuit board processing line, including laser drill and laser-direct imaging)
  • Optical laboratory (including hot embossing, micro-optical assembly, component and system characterization)
  • Micromechatronics laboratory
  • Encapsulations (conformal coating, potting, flip-chip and CoB molding, needle and jet dispensing, transfer and liquid molding, wafer-level encapsulation)
  • Textile laboratory (integration of electronics in textiles)
  • SMD & flip chip line (Datacon EVO, Siplace X-Placer, Asymtek Axiom Jet, Dispense System)



Here you can find further literature on the topic of Embedding & Substrate Technologies.

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