Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Polymer assembly and structuring technologies for optical and fluidic applications

In its work on polymer-based optical packaging and interconnection technologies, Fraunhofer IZM investigates technologies and processes for constructing photonic assemblies by gluing and polymer fiber bonding and the structuring of polymers by hot stamping.

 

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Measuring adhesive shrinkage

Characterization of adhesives and adhesive systems for photonic assembly and interconnection technology

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Additive Manufacturing (3D Printing)

Stereolithography or SLA is a 3D-printing technology used to turn polymer-based functional materials into precisely engineered parts or tools.

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Design and manufacturing of planar polymer optical waveguides

Polymeric materials are essential components of modern and cost-effective microoptic and opto-electronic systems. Their spectral transparency and reliability are optimal for certain applications.

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Laser-structured
adhesive tapes for chip integration

Thin double-sided adhesive tapes offer bonding solutions at room temperature to integrate planar chips with mismatched thermal expansion coefficients. Well-defined microscale shapes can also be transferred to the tapes using pulsed laser irradiation.

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Picolitre dosing system for applying liquids to substrates in photonic applications

The innovative dosing technology can handle liquids with a range of viscosities (from 200 mPa*s to 10000 mPa*s) for a flexible choice of materials.

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