From May 7-9, 2019 the SMTconnect – Europe’s leading trade fair for System Integration in Micro Electronics – will be taking place in Nürnberg. Current products, services and innovations in the field of electronic manufacturing from a wide and international range will be presented to the public. Main topics are design and development, PCB production, components, assembly, soldering, packaging and test systems.
We cordially invite you to visit Fraunhofer IZM in Hall 4! There you will find the latest trends in electronic packaging, smart system integration and reliability analyses from our laboratories. Have a look at the newest applications in power electronics, assembly and interconnection technologies.
Come and see us in Hall 4, booth 258.