Fraunhofer Institute for Reliability and Microintegration IZMIntegration on substrate, board and module level
Due to increased demand for high-performance but cost-efficient solutions, advanced functionalities are also integrated on package or module level using established technologies. Two different approaches are possible here. Either several components can be integrated into a single mold package or one or several unhoused components can be embedded in a PCB or another type of substrate. Hybrids of the two approaches are also manufactured.
Digital and non-digital functions can be integrated as unhoused components into the substrate using embedding technology. Development to date has demonstrated that both passive (e.g. filters, antennas) and active components (thinned ICs, power MOSFETs, sensor layers etc.) can be integrated. The approach promises higher integration densities, improved RF and thermal properties and increased reliability. Depending on the assembly and supply chain in question, manufacturing costs may also be reduced.