Key Research Areas

Integration on substrate, board and module level

Due to increased demand for high-performance but cost-efficient solutions, advanced functionalities are also integrated on package or module level using established technologies. Two different approaches are possible here. Either several components can be integrated into a single mold package or one or several unhoused components can be embedded in a PCB or another type of substrate. Hybrids of the two approaches are also manufactured.

Digital and non-digital functions can be integrated as unhoused components into the substrate using embedding technology. Development to date has demonstrated that both passive (e.g. filters, antennas) and active components (thinned ICs, power MOSFETs, sensor layers etc.) can be integrated. The approach promises higher integration densities, improved RF and thermal properties and increased reliability. Depending on the assembly and supply chain in question, manufacturing costs may also be reduced.

77GHz Radar for Advanced Driver Assistance Systems

One example of the advantages embedding technologies pose is an innovative high-frequency sensor assembly currently being developed by a consortium of companies and research institutes. As part of the further development of advanced driver assistance systems (ADAS)...

Power MOSFET in Embedding Technology

Another approach that harnesses the benefits of 3D assembly can be found in power electronics. Power MOSFETs generate waste heat at volumes and densities that have to be efficiently dissipated.

MultiChip System in Package

Failure analysis, localization and preparation techniques that are standardized and widely accepted by industry for highly complex systems (SiPs) are the focus of this project. The aim is combining the various methodological approaches to meet the demands of automotive suppliers, medical engineering and infrastructure manufacturers for accelerated life and temperature testing of SiPs.