Wafer Level System Integration



2.5/3D Technologies

  • TSV Integration
  • Silicon interposer TSV first
    • TSV via middle
    • TSV via last
    • Device stack

High Density Redistribution




  • Back grinding tape lamination
  • Wafer backgrinding
  • Polishing
  • mechanical blade dicing
  • laser grooving
  • laser stealth dicing
  • wafer edge trimming

High-Density Assembly

  • Fine pitch assembly for pixel detectoren
  • Interconnect metallurgy and processes
  • Thermo compression bonding
  • Chip-Stacking
  • Fine-pitch flip chip (FC) assembly & die bonding
  • Wafer-level solder ball attach (100 – 500 μm)
  • Evaluation of low-temperature assembly technologies
  • Evaluation of flux free solder connections with self alignment capability
  • Reliability investigation of flip chip interconnections

Failure Analysis & Reliability Investigation

  • Metrology: Bump heights / TSV depth measurement, defect inspection, topology, layer thickness, wafer thickness & bow/ warp (VIS), wafer thickness (infrared), die warpage measurement, physical failure analysis
  • FIB / REM imaging

Sensor Development

  • Sensor design
  • Reliability and lifetime optimization
  • Standard and customer-specific packaging with integrated sensor data processing e.g. TO8,  packages with  media separation, molding
  • Characterization of pressure (10 m-100 Bar), gas and acceleration sensors (up to 40 g)
  • Overview sensor activities


More Service Information

Find more detailed information to various service offers for download.

ISO 9001

The department part in Moritzburg (IZM-ASSID) is working with an ISO 9001 certified management system to guarantee  highest quality standards.