Wafer Level System Integration

Services

Services

2.5/3D Technologies

  • TSV Integration
  • Silicon interposer TSV first
    • TSV via middle
    • TSV via last
    • Device stack

High Density Redistribution

Wafer-Bumping

Wafer-Bonden

Thinning/Singulation/Dicing

  • Back grinding tape lamination
  • Wafer backgrinding
  • Polishing
  • mechanical blade dicing
  • laser grooving
  • laser stealth dicing
  • wafer edge trimming

High-Density Assembly

  • Fine pitch assembly for pixel detectoren
  • Interconnect metallurgy and processes
  • Thermo compression bonding
  • Chip-Stacking
  • Fine-pitch flip chip (FC) assembly & die bonding
  • Wafer-level solder ball attach (100 – 500 μm)
  • Evaluation of low-temperature assembly technologies
  • Evaluation of flux free solder connections with self alignment capability
  • Reliability investigation of flip chip interconnections

Failure Analysis & Reliability Investigation

  • Metrology: Bump heights / TSV depth measurement, defect inspection, topology, layer thickness, wafer thickness & bow/ warp (VIS), wafer thickness (infrared), die warpage measurement, physical failure analysis, preparation techniques 3D stack
  • FIB / REM imaging

Sensor Development

  • Sensor design
  • Reliability and lifetime optimization
  • Standard and customer-specific packaging with integrated sensor data processing e.g. TO8,  packages with  media separation, molding
  • Characterization of pressure (10 m-100 Bar), gas and acceleration sensors (up to 40 g)
  • Planar technologies (SiO, SIN deposition, Sputtering)
  • Overview sensor activities

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More Service Information

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ISO 9001

The department part in Moritzburg (IZM-ASSID) is working with an ISO 9001 certified management system since 2015. The department part in Berlin has completed its certification in 2018. The whole department has now all prerequisites to guarantee highest quality standards.