Fraunhofer Institute for Reliability and Microintegration IZMProcess and Product Development
System integration on flexible and rigid substrates
- Diebond, Pick and Place
- Flip Chip Adhesive Bond Technologies
- Flip Chip Soldering on Flexible Substrates
- Ultrafine Pitch Soldering on Flexible Substrates
- Ultrathin Solder Interconnections
- Ultrathin Flip Chip Assemblies
- Die and Wire Bonding for High Frequency Applications
- Conformable Electronics
- Embedding
- NCA-Bonding interconnection process for E-Textiles