Achieving reliability for electronic packages and technologies is a necessary but also complex task. The application of reliability simulation models, which are based on valid characterisation data, can help to reduce the effort and gain additional insights that contribute to improved reliability.
The team applies and develops models that are used to evaluate the reliability of electronic components and assemblies. In this context, the focus is on thermal and thermo-mechanical degradation effects. The basis for these models is formed by realistic material properties, which are determined in-house. In addition, the models are validated by special deformation and stress measurements. This makes it possible to develop trustworthy models for new technologies for which models do not yet exist.
Current research topics cover: Warpage prediction in FO-WLP, FO-PLP and PCB-embedded packages; Reliability and ageing of RF-packages and materials; Advanced damage modelling in power electronics interconnection technologies; Reliability of substrates and via technologies.